HAL will be down for maintenance from Friday, June 10 at 4pm through Monday, June 13 at 9am. More information
Skip to Main content Skip to Navigation
Journal articles

Electromagnetic analysis for optical coherence tomography based through silicon vias metrology

Abstract : This paper reports on progress in the analysis of time-domain optical coherence tomography (OCT) applied to the dimensional metrology of through-silicon vias (TSVs), which are vertical interconnect accesses in silicon, enabling three-dimensional (3D) integration in microelectronics, and estimates the deviations from earlier, simpler models. The considered TSV structures are 1D trenches and circular holes etched into silicon with a large aspect ratio. As a prerequisite for a realistic modeling, we work with spectra obtained from reference interferograms measured at a planar substrate, which fully includes the dispersion of the OCT apparatus. Applying a rigorous modal approach, we estimate the differences to a pure ray tracing technique. Accelerating our computations, we focus on the relevant fundamental modes and apply a Fabry–Perot model as an efficient approximation. Exploiting our results, we construct and present an iterative procedure based on the minimization of a merit function, which concludes TSV heights reliably, accurately, and rapidly from measured interferograms.
Complete list of metadata

Cited literature [50 references]  Display  Hide  Download

https://hal-iogs.archives-ouvertes.fr/hal-02348227
Contributor : Christophe Sauvan Connect in order to contact the contributor
Submitted on : Tuesday, November 5, 2019 - 12:53:32 PM
Last modification on : Thursday, February 10, 2022 - 10:36:04 AM
Long-term archiving on: : Friday, February 7, 2020 - 1:05:38 PM

File

Elmag analysis of TSV - W Iff ...
Files produced by the author(s)

Identifiers

Citation

W. Iff, J.-P. Hugonin, Christophe Sauvan, M. Besbes, P. Chavel, et al.. Electromagnetic analysis for optical coherence tomography based through silicon vias metrology. Applied optics, Optical Society of America, 2019, 58 (27), pp.7472-7488. ⟨10.1364/AO.58.007472⟩. ⟨hal-02348227⟩

Share

Metrics

Record views

33

Files downloads

164