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Electromagnetic analysis for optical coherence tomography based through silicon vias metrology

Abstract : This paper reports on progress in the analysis of time-domain optical coherence tomography (OCT) applied to the dimensional metrology of through-silicon vias (TSVs), which are vertical interconnect accesses in silicon, enabling three-dimensional (3D) integration in microelectronics, and estimates the deviations from earlier, simpler models. The considered TSV structures are 1D trenches and circular holes etched into silicon with a large aspect ratio. As a prerequisite for a realistic modeling, we work with spectra obtained from reference interferograms measured at a planar substrate, which fully includes the dispersion of the OCT apparatus. Applying a rigorous modal approach, we estimate the differences to a pure ray tracing technique. Accelerating our computations, we focus on the relevant fundamental modes and apply a Fabry–Perot model as an efficient approximation. Exploiting our results, we construct and present an iterative procedure based on the minimization of a merit function, which concludes TSV heights reliably, accurately, and rapidly from measured interferograms.
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Contributor : Christophe Sauvan Connect in order to contact the contributor
Submitted on : Tuesday, November 5, 2019 - 12:53:32 PM
Last modification on : Thursday, February 10, 2022 - 10:36:04 AM
Long-term archiving on: : Friday, February 7, 2020 - 1:05:38 PM


Elmag analysis of TSV - W Iff ...
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W. Iff, J.-P. Hugonin, Christophe Sauvan, M. Besbes, P. Chavel, et al.. Electromagnetic analysis for optical coherence tomography based through silicon vias metrology. Applied optics, Optical Society of America, 2019, 58 (27), pp.7472-7488. ⟨10.1364/AO.58.007472⟩. ⟨hal-02348227⟩



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