Interpretation of stress variation in silicon nitride films deposited by electron cyclotron resonance plasma

Abstract : We report here on internal stress variations in filmsdeposited on silicon by plasma enhanced chemical vapor deposition-electron cyclotron resonance (PECVD-ECR) plasma. The effects of deposition parameters, film thickness and surface morphology have been considered. films can exhibit a compressive or a tensile internal stress, ranging from to , depending on deposition parameters. Among published results, usual reported residual stress for PECVDfilms is compressive. Versatility of our experimental ECR equipment allows one to depositfilms exhibiting a weak stress in the range of a few tens MPa. On the basis of atomic force microscopy observations, a correlation between the intensity of the stress and the granular morphology of the films has been observed. The rms value for filmsurfaces is never higher than , with a grain height ranging from 1.2 to and a grain width varying from 20 to . Both the grain size and the residual stress vary with the thickness of the films. This work highlights the influence of the initial surface properties on the deposition mechanism. An exhaustive review of the stress generation model is given and a tentative interpretation for the origin of stress, either compressive or tensile, is proposed.
Document type :
Journal articles
Complete list of metadatas

Cited literature [39 references]  Display  Hide  Download

https://hal-iogs.archives-ouvertes.fr/hal-00880990
Contributor : Fatima Pereira <>
Submitted on : Thursday, November 7, 2013 - 11:28:45 AM
Last modification on : Monday, December 10, 2018 - 10:08:01 AM
Long-term archiving on : Friday, April 7, 2017 - 10:38:30 PM

File

11_Besland_2004.pdf
Publisher files allowed on an open archive

Identifiers

Collections

Citation

Marie-Paule Besland, Mickael Lapeyrade, Franck Delmotte, Guy Hollinger. Interpretation of stress variation in silicon nitride films deposited by electron cyclotron resonance plasma. Journal of Vacuum Science and Technology A, American Vacuum Society, 2004, 22 (5), pp.1962-1970. ⟨10.1116/1.1776179⟩. ⟨hal-00880990⟩

Share

Metrics

Record views

391

Files downloads

2625