, Assembly and Packaging, International Technology Roadmap for Semiconductors, 2009.
High aspect ratio silicon etch: A review, J. Appl. Phys, vol.108, issue.5, p.51101, 2010. ,
A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding, IEEE International Electron Devices Meeting, 2008. ,
Reflectometer-based metrology for high-aspect ratio via measurement, Opt. Express, vol.18, issue.7, pp.7269-7280, 2010. ,
Characterization of high density through silicon vias with spectral reflectometry, Opt. Express, vol.19, issue.7, pp.5993-6006, 2011. ,
In-line metrology of 3D interconnect processes, Proc. of SPIE, vol.8324, p.832411, 2012. ,
Spectral reflectometry for metrology of three-dimensional through-silicon vias, J. Micro/Nanolith. MEMS MOEMS, vol.13, issue.1, p.11209, 2014. ,
In-line through silicon vias etching depths inspection by spectroscopic reflectometry, Microelectron. Eng, vol.122, pp.25-28, 2014. ,
Through silicon via profile metrology of Bosch etching process based on spectroscopic reflectometry, Microelectron. Eng, vol.139, pp.70-75, 2015. ,
3D Through Silicon Via profile metrology based on spectroscopic reflectometry for SOI applications, Proc. of SPIE, vol.9890, p.989015, 2016. ,
Very high aspect ratio through silicon via reflectometry, Proc. of SPIE 10329, p.103293, 2017. ,
Wafer Thickness Sensor (WTS) for etch depth measurement of TSV, 2009 IEEE International Conference on 3D System Integration, pp.1-5, 2009. ,
Backside Infrared Interferometric patterned Wafer Thickness Sensing for Through-Silicon-Via (TSV) etch Metrology, IEEE, vol.23, issue.3, pp.419-422, 2010. ,
Through-silicon-via process control in manufacturing for SiGe power amplifiers, IEEE 63rd Electronic Components and Technology Conference, pp.221-226, 2013. ,
Perspective: Optical measurement of feature dimensions and shapes by scatterometry, APL Materials, vol.6, issue.5, p.58201, 2018. ,
A Comparison of TSV Etch Metrology Techniques, EOS annual meeting, 2018. ,
URL : https://hal.archives-ouvertes.fr/hal-02343393
, Optical Coherence Tomography, 2008.
Progress in Time-Domain Optical Coherence Tomography for TSV / 3Di stacking Metrology, International Microelectronics Assembly and Packaging Society (IMAPS), 14th International Conference and Exhibition on Device Packaging WekoPa, Resort and, p.46, 2018. ,
Through Silicon Via Process Characterization by Integrated Inspection/Metrology Solutions in Visible and Infrared Domain, IEEE, 26 th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), pp.90-95, 2015. ,
A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices, Scientific Reports, vol.8, p.15342, 2018. ,
Spatial coherence effect on layer thickness determination in narrowband fullfield optical coherence tomography, Appl. Opt, vol.50, issue.18, pp.3021-3027, 2011. ,
Ultrahigh-resolution full-field optical coherence tomography using spatial coherence gating and quasi-monochromatic illumination, Opt. Lett, vol.37, issue.4, pp.458-460, 2012. ,
Contact free on-axis metrology for the fabrication and testing of complex optical systems, Proc. SPIE, vol.5965, p.596510, 2005. ,
A novel, low coherence fibre optic interferometer for position and thickness measurements with unattained accuracy, Proc. SPIE, vol.6189, p.618918, 2006. ,
Efficient nonlinear algorithm for envelope detection in white light interferometry, J. Opt. Soc. Am. A, vol.13, issue.4, pp.832-843, 1996. ,
Methods to Measure the Critical Dimension of the Bottoms of Through-Silicon Vias Using White-Light Scanning Interferometry, J. Opt. Soc. Korea, vol.18, issue.5, pp.531-537, 2014. ,
Factorization rules of discontinuous functions applied to Fourier-Bessel basis, J. Opt. Soc. Am. A, vol.21, issue.1, pp.46-52, 2004. ,
Differential theory of diffraction by finite cylindrical objects, J. Opt. Soc. Am. A, vol.22, issue.3, pp.481-490, 2005. ,
URL : https://hal.archives-ouvertes.fr/hal-00015522
, Principles of Optics, 1999.
Photon confinement in photonic crystal nanocavities, Laser & Photon. Rev, vol.2, issue.6, pp.514-526, 2008. ,
URL : https://hal.archives-ouvertes.fr/hal-00566678
Silver Nanowires as Surface Plasmon Resonators, Phys. Rev. Lett, vol.95, issue.25, p.257403, 2005. ,
Simulation of a Time-Domain OCT device for Through Silicon Via (TSV) fabrication, EOS annual meeting, 2018. ,
The effect of water dispersion and absorption on axial resolution in ultrahigh-resolution optical coherence tomography, Opt. Express, vol.13, issue.6, pp.1860-1874, 2005. ,
Use of grating theories in integrated optics, J. Opt. Soc. Am. A, vol.18, issue.11, pp.2865-2875, 2001. ,
URL : https://hal.archives-ouvertes.fr/hal-00867923
Perfectly matched layers as nonlinear coordinate transforms: a generalized formalization, Opt. Soc. Am. A, vol.22, issue.9, pp.1844-1849, 2005. ,
URL : https://hal.archives-ouvertes.fr/hal-00869730
Algorithm for the rigorous coupled-wave analysis of grating diffraction, J. Opt. Soc. Am. A, vol.11, issue.4, pp.1321-1331, 1994. ,
Formulation and comparison of two recursive matrix algorithms for modeling layered diffraction gratings, J. Opt. Soc. Am. A, vol.13, issue.5, pp.1024-1035, 1996. ,
, Fogale Nanotech, 125 Rue de l'Hostellerie, vol.30900
Assessment of technology and (thermo)mechanical behavior of MEMS devices by interference microscopy, Proc. SPIE, vol.5856, 2005. ,
Principles of interference microscopy for the measurement of surface topography, Adv. Opt. Photon, vol.7, issue.1, pp.1-65, 2015. ,
Angle-resolved three-dimensional analysis of surface films by coherence scanning interferometry, Opt. Lett, vol.32, issue.12, pp.1638-1640, 2007. ,
Scanning interferometry for thin film thickness and surface measurements, 2008. ,
Measurement of thin films using Fourier amplitude, pp.7612891-7612893, 2009. ,
Thickness-profile measurement of transparent thin-film layers by white-light scanning interferometry, Appl. Opt, vol.38, issue.28, pp.5968-5973, 1999. ,
Thin-film thickness profile measurement using a Mirau-type low-coherence interferometer, Meas. Sci. Technol, vol.24, issue.7, pp.75002-75003, 2013. ,
Sensitivity analysis of thin-film thickness measurement by vertical scanning whitelight interferometry, Appl. Opt, vol.51, issue.23, pp.5668-5675, 2012. ,
Transparent film profiling and analysis by interference microscopy, Proc. SPIE, vol.7064, p.70640, 2008. ,
, Numerik für Ingenieure und Naturwissenschaftler, 2005.
, Mathematical methods for physics and engineering, 2006.
GNUPLOT ,