A-CNx Copper Films CNTs’ collapse Carbon Nanotube Band alignment Transfert d'énergie Residual stress Thin films B2 Semiconducting indium compounds A Multilayers NEXAFS A Thin films Aluminium nitride Selenization Ambipolar material Capacitance Resistive switching Alloying Non-volatile memory Chemical detection A1 Characterization Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation Sputtering Kirkendall effect CaTiO3Pr^3^+ Biomasse CHLORINE PLASMAS 3 nm in size Buffer Couple BOMBARDMENT Spectroscopic ellipsometry SF 6 CH4 Adsorption Ablation laser AlN Carbon nanotubes Avalanche breakdown PECVD A Chalcogenides Scanning electron microscopy Mott insulator CIGSe Vanadium Sesquioxide Bipolar resistive switching BRS Sol-gel X-ray photoelectron spectroscopy Calcined clay Biocapteurs Chalcogenide Applications industrielles Biofilms microbiens Magnetron sputtering Band gap Chalcogenides AZO thin films B2 Quaternary Amorphous Thin film Aryl-diazonium salts Plasma etching Amyloid precursor B Chemical synthesis Oxides Etching Atomic layer etching V2O3 TiO2 Nanotubes Optical properties Cathepsin Transmission electron microscopy Titanium dioxide A3 Physical vapor deposition processes Semiconductors TEM Carbon Chalcogenide glass Functionalization Atomic force microscopy Physical vapor deposition Plasmas froids Carbon nitride Colloidal solution Anatase Structure XPS Low-pressure plasma processing Alzheimer's disease AuCu alloy Bixbyite B1 Inorganic compounds Mott insulators B3 Solar cells Chemical and biological sensors Nanocomposite C Photoelectron spectroscopy B2 Semiconducting alloys X-ray diffraction